Transition to boards coated with "immersion gold" technology

Transition to boards coated with "immersion gold" technology

The Rustechnology company has completely switched over to the use in the production process of printed circuit boards with a finish coating made using immersion gilding technology. These boards are now used in all lines of devices manufactured by our company: industrial telemetry units BBT-1/2/3, wireless telemetry units for the utility sector BBT-4/5/6, stand-alone pressure and temperature sensors of the BBT-DDT series.

Immersion gold (ENIG) is the chemical deposition of a gold layer on a nickel sublayer. One of the main alternatives to HASL technology. It is a top coat of the Ni / Au family (Immersion Gold + Electroless Nickel). The basic thickness of the gold layer is 0.05-0.1 microns, nickel is 3-7 microns. The material meets all the mandatory requirements of the EU RoHS directive.

Benefits of using:

• Immersion gold is a safe, lead-free finish.
• Allows additional in-circuit testing.
• Create perfectly flat, smooth pads.
• Provides good solderability and high surface conductivity.
• The material is durable and is not susceptible to ionic contamination, does not oxidize.
• It can be applied to components with a small pitch (0.4-0.5 mm), using various types of soldering (including multiple ones) and mounting methods (for example, bonding crystals).